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BN Ceramic Plates Boron Nitride Plate Substrate | Labshopx

Original price $62.00 - Original price $199.00
Original price
$62.00
$62.00 - $199.00
Current price $62.00

Boron Nitride Plates Description:

  • Type:Boron Nitride plates
  • Material:99%Boron Nitride 
  • Quantity:If there are need more quantites, get wholesale price please contact us.E-mail us at info@labshopx.com
  • Customize:If you need others size,we can customize as your size.E-mail us at info@labshopx.com
  • Import duties or taxes are not included in the item price or shipping charges. These charges are the buyer's responsibility.

Boron Nitride Property:  

Boron Nitride Ceramic Sheets Feature:

(A) Physical Properties

  • High Hardness: Second only to a few super - hard materials like diamond, with excellent wear resistance, suitable for cutting tool coatings or wear - resistant component surfaces.
  • Low Density: Approximately 2.27 g/cm³, beneficial for aerospace applications, reducing weight and improving aircraft performance.
  • Good Thermal Conductivity: Relatively high thermal conductivity, used for heat dissipation in electronic devices such as computer CPU coolers.

(B) Chemical Properties

  • Chemical Stability: Highly resistant to most acids, alkalis, and organic solvents, used as lining materials for chemical equipment to prevent container corrosion.
  • Oxidation Resistance: Shows good oxidation resistance at high temperatures and remains chemically stable within a certain temperature range (e.g., below 1000°C), applicable in high - temperature industrial furnaces.

(C) Electrical Properties

  • High Resistivity: A good electrical insulator, used for insulation in high - voltage electrical equipment like transformers and insulators.
  • Excellent High - Frequency Performance: The dielectric

Boron Nitride Plates Applications:

(A) Electronics Industry

  • Heat Dissipation Management: Utilizing good thermal conductivity and high resistivity, it is made into radiators or substrate to dissipate heat from heat - generating components and avoid short - circuits.
  • Electronic Component Packaging: As part of the protective shell, it provides physical protection and ensures the normal operation of electronic components.

(B) Aerospace Field

  • Heat - Insulation Materials: Used in aircraft heat - insulation shields and engine thermal protection systems to protect internal equipment from high temperatures.
  • Lightweight Structural Components: Made into connectors and brackets to reduce the weight of aircraft and improve payload and performance.

(C) Chemical Industry

  • Corrosion - Resistant Equipment Lining: Used for lining equipment and reaction kettles for storing or processing corrosive media to prevent corrosion.
  • Chemical Pipeline Protection: Pasted or inlaid on the inner walls of pipelines to prevent corrosion and perforation, ensuring safe transportation.

(D) Other Fields

  • High - Temperature Industrial Furnaces: As heat - insulation and high - temperature structural materials, it reduces heat loss, improves energy utilization efficiency, and withstands high - temperature stress.
  • Nuclear Industry: Can be used in nuclear reactor control rod assemblies as neutron - absorbing materials to regulate the nuclear reaction rate.
  •  constant is stable and the loss is small under high - frequency electric fields, suitable for radio frequency and microwave equipment such as microwave circuit substrates.

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